SemiconductorAdvancedServices

Integration & Systems Authority

End-to-End Engineering Authority for Advanced Semiconductor Testing

SAS Advanced Technologies delivers expert high speed PCB and IC substrate design, SI and PI simulation, 112G PAM4 engineering, and production-driven execution from concept through manufacturing

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Wafer probe card used to test a silicon wafer.

Engineering Authority

Leeno and SAS engineering collaboration represented over advanced semiconductor hardware.

SAS × Leeno Collaboration

CMOS image sensor probe card for advanced semiconductor testing.

Advanced Programs

Coordinated semiconductor hardware system with PCB, fixture, cooling, interconnect, signal, schedule, and validation elements

The Challenge

Complex Hardware Requires Coordinated Execution

Advanced test hardware involves multiple engineering disciplines, manufacturers, interfaces, and technical dependencies. When these activities are managed separately, projects become slower, less predictable, and harder to control.

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Multiple Disciplines

PCB, package, mechanical, thermal, SI, PI, and more.

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Many Interfaces

Electrical, mechanical, firmware, and system-level interfaces.

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Tight Schedules

Programs demand speed, accuracy, and predictability.

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Zero Room for Error

Quality and reliability directly affect your product.

SAS provides one coordinated engineering and delivery process.

Why SAS

Why Partners Choose SAS

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One Responsible Partner

We own the program from requirements to delivery.

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Engineering Connected

Design decisions reflect manufacturing and production constraints.

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Global Capability, Local Ownership

Specialized international partners combined with direct local support.

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Built for Complex Programs

Experience across compute, networking, automotive, sensing and advanced systems.

Engineering Domains

Engineering Expertise Across Advanced Semiconductor Hardware

SAS delivers deep engineering capabilities across the full hardware lifecycle, from design and simulation through manufacturing and production execution.

High Speed PCB Design for Advanced Semiconductor Systems

Constraint-driven multilayer PCB engineering for high speed compute, RF, mixed-signal, and advanced semiconductor platforms.

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IC Package and Substrate Design

Advanced substrate and package engineering for high performance semiconductor platforms.

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Signal Integrity and Power Integrity Simulation

End-to-end SI and PI analysis for package, board, connector, and system-level performance optimization.

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112G PAM4 and Advanced Interconnect Engineering

High speed serial channel engineering for next-generation semiconductor and compute platforms.

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Silicon Photonics and Co-Packaged Optics (CPO)

Engineering support for silicon photonics integration, optical interfaces, and high-speed photonic test environments.

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Design for Manufacturability and Production Execution

Transforming advanced engineering concepts into manufacturable and scalable semiconductor hardware platforms.

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Delivery Workflow

How SAS Delivers Semiconductor Programs

From requirements and design review through fabrication, assembly, qualification, and production support, SAS runs one structured delivery flow.

Requirements

Program requirements, target specifications, compliance needs, and manufacturing assumptions are defined at the outset.

Design & Engineering

Package, board, RF, thermal, and mechanical engineering advance in one coordinated semiconductor development flow.

Fabrication & Assembly

Fabrication, precision machining, PCBA, socket build, and subsystem assembly are executed against qualified production standards.

Test & Qualification

Electrical test, reliability, characterization, and qualification data are captured to verify performance before release.

Ramp & Sustain

Production transfer, sustaining engineering, documentation control, and change management support long-term delivery.

Product Focus

Products We Design, Build, and Qualify

Representative semiconductor hardware programs delivered across SAS engineering, manufacturing, assembly, and test.

Probe interface board product — Probe Interface Board

Characterization board product — Characterization Board

Global Engineering and Manufacturing Network

SAS Delivery Footprint Across Asia and Israel

SAS operates across a global ecosystem of engineering, manufacturing, and supply chain partners, enabling efficient execution across regions and production environments.

South Korea