Engineering Expertise Across Advanced Semiconductor Hardware

SAS brings package, board, simulation, interconnect, photonics, DFM, manufacturing, and production thinking into one technical delivery model.

Explore the six SAS engineering domains that support advanced semiconductor programs from concept and architecture through layout, simulation, build, qualification, and scalable production.

Advanced semiconductor engineering domains

Domain Overview

Choose the Engineering Domain

Each page expands the scope, working model, deliverables, and handoff expectations for that technical area.

Close-up of a high-quality multilayer printed circuit board

Engineering Domain

High Speed PCB Design

Constraint-driven multilayer PCB engineering for high speed compute, RF, mixed-signal, and advanced semiconductor platforms.

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Close-up view of a silicon wafer for package and substrate design

Engineering Domain

IC Package and Substrate Design

Advanced substrate and package engineering for high performance semiconductor platforms.

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Signal integrity diagram comparing dielectric constant, signal velocity, dielectric loss, and insertion loss

Engineering Domain

SI and PI Simulation

End-to-end SI and PI analysis for package, board, connector, and system-level performance optimization.

View domain

Open eye diagram displayed on an oscilloscope

Engineering Domain

112G PAM4 and Advanced Interconnect

High speed serial channel engineering for next-generation semiconductor and compute platforms.

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Silicon wafer close-up representing silicon photonics engineering

Engineering Domain

Silicon Photonics and CPO

Engineering support for silicon photonics integration, optical interfaces, and high-speed photonic test environments.

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Multilayer PCB construction diagram showing copper layers, cores, prepreg, and plated vias

Engineering Domain

DFM and Production

Transforming advanced engineering concepts into manufacturable and scalable semiconductor hardware platforms.

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Integration Model

Why the Domains Work Together

Advanced semiconductor programs rarely fail in one isolated discipline. SAS structures the work so interfaces, constraints, and build assumptions are visible across the stack.

Architecture to implementation

SAS connects early system decisions to package, substrate, PCB, interconnect, simulation, fixture, and production constraints.

Simulation to build readiness

SI, PI, channel, thermal, and DFM feedback loops are used to reduce bring-up risk before release data is frozen.

Prototype to repeat production

Manufacturing, assembly, inspection, test, and sustaining requirements are built into the engineering flow.

Next Step

Bring SAS Into the Domain Where Your Program Has Risk

Start with a single domain or use SAS across the full engineering and manufacturing delivery model.

Contact SAS Delivery Model