Silicon photonics integration support
Engineering Domains/Silicon Photonics and CPO
Engineering Domain
Silicon Photonics and Co-Packaged Optics (CPO)
Engineering support for silicon photonics integration, optical interfaces, and high-speed photonic test environments.
SAS supports silicon photonics and co-packaged optics programs through electrical, optical, thermal, and mechanical engineering integration activities.
Engineering Capabilities
What SAS Executes in This Domain
04
Capabilities
SAS
Execution CoreSilicon Photonics and CPO
Optical interface integration
SiPh test environments
Integrated test channel development
Engineering Model
Decisions That Keep the Program Buildable
Optical and electrical paths co-designed
Fiber access, launch geometry, high speed routing, package interface, and test fixtures are developed as connected constraints.
Thermal stability built in
Heat paths, mechanical preload, and fixture behavior are considered early because optical performance is sensitive to movement and temperature.
Test access planned before build
Characterization and production test needs shape the board, socket, probe, and fixture strategy from the beginning.
Program Flow
From Definition to Release
Each domain page uses a practical flow that keeps design choices connected to implementation, review, and handoff.
01
Integration map
Clarify optical coupling, package interface, high speed links, thermal limits, and the expected validation environment.
02
Board and fixture concept
Plan electrical breakout, optical access, mechanical support, and controlled test handling as one assembly.
03
Design and review
Implement the board, substrate, fixture, or module hardware with SI, thermal, mechanical, and DFM reviews.
04
Build and validation support
Support prototype build, measurement readiness, assembly feedback, and production transfer decisions.
Release Package
Outputs Built for Review, Build, and Transfer
SAS structures domain work so the final handoff is practical for engineering review, supplier execution, lab bring-up, and controlled production transfer.
SiPh or CPO integration architecture notes
Characterization board, fixture, or interface design data
Electrical, thermal, and mechanical review outputs
Build support package for prototype and production learning
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